Material properties of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack in ...

Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets ...

will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...