电子工程专辑10 个月
3D IC 设计解决方案
Xpedition™ Package Designer (xPD) 软件专为新兴高密度先进封装 (HDAP ... 准确识别 EM 电流密度违规情况，以及为 3D-IC 封装设计提供准确的提取和建模。 将 2.5D 3D IC 物理验证提升到更高水平 随着封装设计的发展，验证要求和挑战如影相随。设计人员在处理 2.5/3D IC 设计 ...
Semiconductor Engineering4 天
Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many ...
Material properties of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack in ...
Design-Reuse2 年
IMEC sets major step towards 3D integration of DRAM on logic
will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...