Chiplet标志着半导体创新的新时代，封装是这个设计事业的内在组成部分。然而，虽然Chiplet和封装技术携手合作，重新定义了芯片集成的可能性，但这种技术合作并不是那么简单和直接。 在芯片封装中，裸芯片封装在带有电触点的支撑盒中。外壳保护裸模免受 ...

小芯片（Chiplet）技术的推动下，芯片设计领域出现了两种方法，自上而下和自下而上，逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...

小芯片（Chiplet）技术的推动下，芯片设计领域出现了两种方法，自上而下和自下而上，逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小芯片的插槽规格，以保持对市场的控制； 而众多初创公司、系统公司和政府机构则倡导自上而下的方法 ...

November 20, 2024 -- Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement ...

But there is an underlying tug-of-war underway between large, vertically integrated players that want to tightly define the socket specifications for chiplets, and a broad swath of startups, systems ...

Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...

The OCP tutorial reports on the open chiplet economy in which designers simply plug in chiplets they get from a marketplace. Other features are a Superpanel on Chiplets - The Key to Solving the AI ...

Design Methods Working with Foundries Applying Die-to-Die Interfaces (sponsored by the UCIe Consortium) Open Chiplet Economy (sponsored by Open Compute Project) Special coverage includes new ...

The OCP tutorial reports on the open chiplet economy in which designers simply plug in chiplets they get from a marketplace. Other features are a Superpanel on Chiplets - The Key to Solving the AI ...

The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its pre-conference day schedule for Tuesday, January 21. Tutorial subjects are ...

AMD was rumored to be looking at a chiplet design for the RDNA 4 flagship, before seemingly canning it (and as we know, Team ...