Gunning with transceiver logic (GTL) and gunning with transceiver logic plus (GTLP) are also available. Package Types, Pins, and Flip-Flops DRAM memory chips are available in a variety of IC package ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

the first to incorporate DRAM directly into the microprocessor package. Normally, laptop makers buy memory modules from third parties and either insert them inside a DRAM slot or solder them down ...

Samsung has started mass production of the world's thinnest LPDDR5X DRAM packages featuring 12 GB and 16 GB capacities. These new products feature a thickness of around 0.65 mm, which is 0.06 mm ...