Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...
There is a new type of EUV lithography using only four reflective mirrors overturns conventional technology and will contribute to advanced semiconductors at 7nm and below. Professor Tsumoru Shintake ...
Andrew Grenville, chief executive of resist maker Inpria, sat down with Semiconductor Engineering to talk about photoresists for extreme ultraviolet (EUV) lithography. What follows are excerpts of ...
Extreme ultraviolet (EUV) lithography is the next step in this trend. It uses radiation of wavelength 13.5 nm, thereby offering significant potential to extend the resolution of photolithography.
Taiwan Semiconductor’s EUV system share grew to 56% globally by 2023, expanding its advanced chip production capacity. Taiwan Semiconductor acquired over 100 EUV machines in 2023, bolstering its ...