DNP has achieved the fine pattern resolution required for photomasks for logic semiconductors of beyond 2nm generation that ...

As feature sizes shrink and device densities increase, ensuring that masks remain defect-free becomes critical.

High NA impacts the mask and EUV as a whole. The industry will need to get a handle on the EUV mask issues in order to have more realistic expectations about EUV lithography in general. To help the ...

Previous photolithography technologies used transmissive masks protected by a pellicle. For EUV lithography, however, the masks must be reflective and cannot have a protective pellicle as this ...

Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to ... the production and inspection of the masks defining the features to be etched, and the output power of the light source.

This also minimizes mask 3D effects. “It’s like the egg of Columbus,” explains Prof. Shintake, “in that it may seem impossible at first glance, but once solved, it becomes very simple.” The global EUV ...

There is a new type of EUV lithography using only four reflective mirrors overturns conventional technology and will contribute to advanced semiconductors at 7nm and below. Professor Tsumoru Shintake ...

including EUV lithography. The goal is to mitigate both particulate and molecular contamination. We have advanced facilities for the inspection and analysis of contamination, cleaning equipment, and ...

a leader in computational lithography and metrology that has been working on e-beam inspection systems specially designed for mask manufacturers to identify pattern defects for EUV masks.

Each low-numerical aperture (NA) extreme ultraviolet (EUV) lithography system costs over US$100 million, making it one of the most expensive semiconductor manufacturing tools in history.

Each low-numerical aperture (NA) extreme ultraviolet (EUV) lithography system costs over US$100 million, making it one of the most expensive semiconductor manufacturing tools in history.