Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...
1d
Tech Xplore on MSNNew bifacial linker enhances adhesion in flexible solar cellsFlexible perovskite solar cells (F-PSCs) have attracted attention for their potential in diverse applications. However, their ...
15d
Hosted on MSNSamsung Electronics prepares to join Intel in glass substrate raceSamsung Electronics is entering the glass substrate market to enhance semiconductor technology. Other companies, including Intel and LG Innotek, are also pursuing this innovation.
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due ...
C&G Hi Tech announced it has succeeded in large-area (510*515mm) thin-film formation with a thickness of over 7N/cm and a ...
3d
Tech Xplore on MSNPowering the future – ultrathin films are revolutionizing electrical conductivityA multi-institutional research team led by Osaka University has engineered a way to preserve the electrical properties of ...
GlobalWafers chairperson Doris Hsu reports that prices for mainstream 6-inch silicon carbide (SiC) substrates have stabilized ...
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