SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chipsSecond-generation “cold field emission” technology ...

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The multi-beam e-beam market for lithography applications continues to undergo a shakeout amid technical roadblocks and other issues. As it turns out, ASML will not continue to develop Mapper’s ...

RAITH150 Two Applications: High Electron Mobility Transistor (HEMT) device with 75 nm T-gate (IUHFSE, Moscow, Russia) RAITH150 Two Applications: 4.5-nm lines and spaces in HSQ e-beam resist (MIT in ...

At SPIE-AL+P 2025, eBeam Initiative members will deliver eight keynote addresses and co-author nearly 300 presentations – more than half of the total number of program talks – on a variety of topics ...

Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the ...

Traditionally, optical techniques are used to scan a wafer for potential defects, and then eBeam is deployed to better characterize these defects. In the emerging “angstrom era” – where the ...

Applied Materials' SEMVision™ H20 system combines the industry’s most sensitive eBeam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale def ...