The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build ...
In this modern era, high-performance computing (HPC) systems have become essential in addressing the increasing complexity of ...
Molex has launched a new line of EMI-filtered interconnects and RF components for aerospace and defense applications.
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology ...
STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters New silicon photonics and next-gen ...
STMicroelectronics has launched a new data center photonics chip, developed in collaboration with AWS. Dubbed the PIC100, ...
Chip maker STMicroelectronics (ST) has revealed details of a new generation of proprietary technologies enabling faster ...
With increasing numbers of CPU cores, multimedia subsystems and communication IPs in today’s System-on-Chips, the main SoC interconnects, crossbars or networks-on-chip fabrics become key components of ...
10d
FNU Parshant's research highlights the impact of scalable interconnects and energy-efficient SoC designs in HPC ...
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