When you learn to solder, you are warned about the pitfalls of creating a solder joint. Too much solder, too little solder, cold joints, dry joints, failing to “wet” the joint properly ...

[Martin Thuo] at Iowa University used this property to make solder joints at room temperature using Field’s metal (a combination of bismuth, indium, and tin). The key is a process that coats the ...

If you choose this soldering unit, take your time and familiarize yourself with the different settings on different metals and joint sizes before embarking on any sensitive projects. Get the ...

Underfill also improves thermal cycling performance, prevents moisture ingress, and mitigates the risk of solder joint failure, thereby extending the lifespan of electronic components. Essemtec’s ...