Design Methods Working with Foundries Applying Die-to-Die Interfaces (sponsored by the UCIe Consortium) Open Chiplet Economy (sponsored by Open Compute Project) Special coverage includes new ...

The OCP tutorial reports on the open chiplet economy in which designers simply plug in chiplets they get from a marketplace. Other features are a Superpanel on Chiplets - The Key to Solving the AI ...

The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its pre-conference day schedule for Tuesday, January 21. Tutorial subjects are ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it ...

虽然汽车市场放缓，汽车半导体预测下修，但这些新技术，仍将提升汽车半导体的性能、带来技术的变革…… 为应对汽车电子 ...

The OCP tutorial reports on the open chiplet economy in which designers simply plug in chiplets they get from a marketplace. Other features are a Superpanel on Chiplets - The Key to Solving the AI ...

Pooling CPU memory for LLM inference; high-bandwidth chiplet interconnects for adv. packaging; dense edge architectures; spiking neuromorphic HW; G ...

Marvell introduced Alaska A for customers looking to extend copper capabilities using AECs, while others can leverage ...

CEA-Leti researchers have developed the first-reported device able to sense light and modulate it accordingly in a single ...