But there is an underlying tug-of-war underway between large, vertically integrated players that want to tightly define the socket specifications for chiplets, and a broad swath of startups, systems ...

They have also become a major venue for increasing transistor density as Moore’s Law slows down. IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications” asserts that ...

November 20, 2024 -- Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement ...

A new technical paper titled “High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was published by researchers at TSMC. “The ...

Design Methods Working with Foundries Applying Die-to-Die Interfaces (sponsored by the UCIe Consortium) Open Chiplet Economy (sponsored by Open Compute Project) Special coverage includes new ...

The OCP tutorial reports on the open chiplet economy in which designers simply plug in chiplets they get from a marketplace. Other features are a Superpanel on Chiplets - The Key to Solving the AI ...

Chiplet标志着半导体创新的新时代，封装是这个设计事业的内在组成部分。然而，虽然Chiplet和封装技术携手合作，重新定义了芯片集成的可能性，但这种技术合作并不是那么简单和直接。 在芯片封装中，裸芯片封装在带有电触点的支撑盒中。外壳保护裸模免受 ...

We architect SOPHIE using 2.5D integration, where we integrate a controller chiplet, a DRAM chiplet, laser sources, and multiple OPCM chiplets. SOPHIE utilizes OPCMs to perform matrix-vector ...

The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its pre-conference day schedule for Tuesday, January 21. Tutorial subjects are ...

Abstract: Multi-chiplet system design, by integrating multiple chiplets/dielets within a single package, has emerged as a promising paradigm in the post-Moore era. This paper introduces a novel task ...

虽然汽车市场放缓，汽车半导体预测下修，但这些新技术，仍将提升汽车半导体的性能、带来技术的变革…… 为应对汽车电子 ...