May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is ...

Identifying bad memory chips can quickly become a chore, so [Jan Beta] spent some time putting together a cheap DRAM tester out of spare parts. This little tester can be used with 4164 and 41256 ...

Later, Samsung will extend the technique to produce system-in-package solutions that stack a processor with one or more memory chips, and high-capacity DRAM packages for servers. The wafer-level ...

Samsung boasts: “With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and ...