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7 小时
The AI Chip Race: Who Can Compete With Nvidia?
Explore how NVIDIA became the leader in AI chips, the challenges it faces from competitors like AMD and Intel, and the impact ...
Digi Times
7 小时
Lattice confident in FPGA competitiveness against ASIC
US-based FPGA maker Lattice Semiconductor held its annual Developers Conference this week, during which the company announced ...
17 小时
Mercury Introduces Digital Signal Processing Products Powered by Altera’s Newest Agilex ...
Mercury’s DRF2270 system-on-module, featuring Altera’s latest Agilex 9 FPGA. ANDOVER, Mass., Dec. 11, 2024 (GLOBE NEWSWIRE) - ...
1 天
on MSN
Just to cap off Intel's annus horribilis, Time picks AMD's Dr Lisa Su as its CEO of the year
Topping off what has been a mostly positive year of fortunes for AMD, Time magazine has picked Dr Lisa Su as its choice of ...
Digi Times
1 天
Japanese firms race to advance 1 nm semiconductor tech
Japan's leading semiconductor materials manufacturers are making strategic moves to develop crucial components for ...
1 天
Fresh Insights: Upgrading Nvidia To Buy For Aggressive Growth Opportunities
Nvidia's position in AI and computing, coupled with a $2.4 trillion market potential, make it a buy despite tariff risks.
Semiconductor Engineering
1 天
Auto Chip Aging Accelerates In Hot Climates
New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
2 天
Instruction Enhancement Programme begins at NIELIT
NIELIT's IEP on FPGA-Based SoC Design under C2S initiative aims to foster semiconductor talent for self-reliant India.
Design-Reuse
2 天
Arasan Announces immediate availability of its SPMI IP (System Power Management Interface)
Arasan expands its MIPI IP portfolio with the announcement of the immediate availability of its SPMI IP (System Power ...
Hackaday
4 天
A Look Inside IKEA’s Vallhorn Motion Sensor Teardown
A good source of hackable home automation parts has come for a while in the form of inexpensive modules offered by large ...
New Electronics
6 天
YorChip and Digitho developing 2D chiplet packaging for mass markets
YorChip and Digitho extend their partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution.
Design-Reuse
6 天
YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution.
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