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Semiconductor Engineering
1 天
GPUs: Bandit Based Framework To Dynamically Reduce Energy Consumption
A new technical paper titled “Online Energy Optimization in GPUs: A Multi-Armed Bandit Approach” was published by researchers ...
TMCnet
1 天
Bringing Digital World into Intelligent World, H3C Unveils the NAVIGATE Global Summit 2024 ...
H3C NAVIGATE Global Summit 2024 was successfully held during the GITEX Global 2024 in Dubai, UAE. The summit, leveraging the ...
Semiconductor Engineering
1 天
3DIO IP For Multi-Die Integration
Synopsys 3DIO IP Solution (figure 4) is specially tuned for multi-die heterogeneous integration with a versatile offering, ...
2 天
Co-promoting a New Ecosystem for AI Prosperity, H3C Globally Launches New Intelligent ...
In the era of AIGC, intelligent computing power has become a core engine driving the development of the digital economy. On ...
2 天
Accelerating Digital Transformation, H3C Showcases Latest Products and Solutions at GITEX ...
GITEX Global 2024 has officially commenced in Dubai, UAE. H3C made a significant presence by showcasing its full-stack ICT ...
Semiconductor Packaging News
2 天
Advancements In Silicon Device Technology And Design Driving New SLM Monitor Categories
Silicon technology continues evolving to overcome its limitations, as innovations like gate-all-around (GAA) transistors and heterogeneous integration enhance performance. Advances in lithography and ...
Cloud Computing
2 天
UiPath teams up with SAP to accelerate enterprise automation for SAP customers
UiPath Platform integrated with SAP Build Process Automation to be sold as one of the SAP Solution Extensions.
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