IT之家 11 月 29 日消息,在本月召开的欧洲开放创新平台(OIP)论坛上,台积电宣布计划在 2027 年推出超大尺寸版晶圆级封装(CoWoS)技术,最高实现 9 倍光罩尺寸(reticle sizes)和 12 个 HBM4 内存堆叠。
For centuries, fantastic tales of terrifying monsters have fascinated mankind. Bizarre beasts of all shapes and sizes have been portrayed in some of history's most classic stories and folklore.