Models, Features and Data Representation Towards a Neural Surrogate” was published by researchers at KTH Royal Institute of ...

On average, 90% of the 4,096 microhole electrodes were intracellularly coupled to neurons on top and were able to record many ...

A new technical paper titled “Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based ...

Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends” was published by researchers at Google.

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That ...

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

The growing imbalance between the amount of data that needs to be processed to train large language models (LLMs) and the ...

Europe funds power fab; PDF's security acquisition; tariffs; NIST concerns; new ALD tool; Malaysia's advanced packaging fab; ...

Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Using lower temperature and no flash point chemicals to achieve comparable deflashing effectiveness without inducing ...