Siemens announces that it has established a host of new certifications for its recently introduced Solido SPICE software ...

Valeo and ROHM Semiconductors are working together to develop and optimise the next generation of power modules.

Tower has announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering.

TDK-Lambda brand CN-B110 power module series now includes 50W, 100W, and 150W rated quarter-brick DC-DC converters.

Murata's new series of HaLow modules (LBWA0ZZ2HK and LBWA0ZZ2HL) are compliant with Sub-1 GHz (S1G) Wi-Fi standards.

Rocket Lab receives CHIPs Act funding to increase its compound semiconductor manufacturing capability and capacity.

How AI can be used to address the complexity issue when designing the next generation of wireless systems and networks.

Peter Carlsson, the CEO and co-founder of Northvolt, quit the company last week and in doing so revealed that it needed a ...

Due to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision ...

Amphenol RF has expanded its AUTOMATE Type A mini-FAKRA portfolio with additional pre-configured breakout cable options.

Belden's Hirschmann EAGLE40-6M next-generation firewall for onboard railway rolling stock environments now available.

The global semiconductor manufacturing industry saw strong growth in the third quarter of 2024, with all key industry ...