A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. “Wafer-level ...

Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...

Currently Akrometrix systems remain the industry leading technology for thermal warpage and strain metrology. Akrometrix techniques are utilized across the world by the leaders of the microelectronics ...

A 3D finite element analysis model that incorporates equivalent material properties for the RDL and Cu pillar bumps is developed to analyze the warpage behavior induced during the FO-LED assembly ...

Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM ...

Dr. Seokpum (Pum) Kim is leading digital manufacturing for polymer composites. Since 2016, Dr. Kim has focused on manufacturing process and design (structure) optimization for polymer composite ...

LG Innotek (CEO Moon Hyuksoo) announced on February 25 that it will launch a new electronic component for vehicles, the ...

Warpage in wafer-level packaging; NVM tutorial; GAAFETs; uncore frequency scaling for heterogeneous systems; simulation of vertically stacked 2D Na ...