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Electronic Products
2 天
Infineon unveils rad-hard Flash memory
Infineon claims the industry’s first rad-hard Flash memory, targeting space and extreme environment applications.
marketinference
3 天
Micron Technology – A Brief Analysis
Micron Technology is part of the Technology sector, which has an average P/E ratio of 30.01 and an average P/B of 3.91 The ...
来自MSN
3 天
Samsung prepares to unveil 10th generation V-NAND with 400+ layers — ready to power ...
Samsung will details its future plans for ultra-fast and ultra-dense 3D TLC NAND, designed for next-generation SSDs. Samsung ...
Nanowerk
3 天
Graphene memory devices mimic brain synapses through chemical modification
Novel memristors using phosphorus-modified graphene switch between memory states through controlled silver ion interactions, ...
EPT
4 天
How MRAM Is enhancing reliability in medical devices
For medical device manufacturers, the adoption of MRAM can result in long-term cost savings. MRAM’s high reliability reduces ...
来自MSN
5 天
Weebit Nano raises $50 million to advance its ReRAM memory tech
Weebit Nano secures $50 million to advance its ReRAM technology, gaining strong investor confidence in the growing ...
7 天
Tellurium nanowires show potential for room-temperature ferroelectricity and data storage
A discovery by an international team of scientists has revealed room-temperature ferroelectric and resistive switching behaviors in single-element tellurium (Te) nanowires, paving the way for ...
electronicsforu
8 天
Embedded Systems: The Essential Tech Behind Everyday Devices
Embedded systems are primarily computers that have been developed to do a specific task. They are often smaller, more ...
JCN Newswire
9 天
Hitachi High-Tech Launches DCR Etch System 9060 Series, Supporting Isotropic Etching of ...
With the 9060 Series, Hitachi High-Tech will support manufacturing process advancements for cutting-edge semiconductor ...
Semiconductor Engineering
9 天
STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...
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